Product Name:
Ceramic Insulation Plate
Product Material:
High-Purity Alumina Ceramic (Al₂O₃ 96%-99.8%). To meet specific requirements for thermal conductivity, machinability, or extreme wear resistance, alternative material solutions such as Aluminum Nitride (AlN), Boron Nitride (BN), or Zirconia Toughened Alumina (ZTA) are available.
Material Characteristics:
Very high dielectric strength (>15-25 kV/mm, depending on purity and thickness) and volume resistivity (>10¹² Ω·cm), Excellent arc resistance and Comparative Tracking Index (CTI > 600 V), High mechanical strength and stiffness, Outstanding thermal stability and low coefficient of thermal expansion, Superior chemical inertness (resistant to acids, alkalis, solvents, and oils), Good wear resistance due to high hardness, Surface can be finished to various roughness levels or metallized, Material is non-combustible, non-aging, and has low outgassing.
Application Fields:
Insulating and heat-spreading substrates (base material for DBC/AMB ceramic substrates) for power semiconductor modules (e.g., IGBT, SiC); Insulating barriers and busbar supports in high-voltage switchgear and circuit breakers; Insulating mounting plates in new energy vehicle motor controllers and charging modules; Circuit mounting boards and isolation spacers in power electronic equipment; Insulating furnace liners and carrier plates in high-temperature furnaces and heating equipment; Insulating bobbins and mounting plates for sensors and transformers.
Application Industries:
Electronic Engineering (Power electronics, circuit packaging), New Energy (New energy vehicles, PV inverters, wind power converters), Semiconductor Manufacturing and Packaging, Advanced Mechanical Equipment (High-power lasers, industrial power supplies), Petrochemical (Explosion-proof electrical equipment), Aerospace (Onboard power systems).
Processing Difficulties:
Controlling sintering deformation and warpage during the manufacture of large-sized, ultra-thin plates; Ensuring极 high flatness, parallelism, and thickness uniformity of plates; Achieving high-precision machining of micro-holes with high aspect ratios and complex profiles; Maintaining edge integrity after machining to avoid chipping; Ensuring high bond strength and excellent thermal cycle reliability between surface metallization (e.g., copper plating, aluminum plating) layers and the ceramic substrate; Meeting stringent application-specific requirements for surface resistivity and weatherability of the plate.
Processing Flow:
Powder selection, formulation, and forming via tape casting or dry pressing → Lamination and isostatic pressing (for multi-layer or thick plates) → High-temperature sintering → Double-side surface grinding and polishing to ensure basic flatness → Precision CNC cutting/dicing to final dimensions → CNC drilling, slot milling, and contour machining → Edge chamfering and refinement → Surface treatment (cleaning, roughening, polishing, laser marking, or metallization) → Comprehensive performance inspection (dimensions, flatness, insulation withstand voltage, thermal conductivity, etc.) → Clean packaging
Delivery Period:
Standard size and thickness plates: 20-40 days
Custom plates with large size / ultra-thin / high precision / complex hole patterns or surface metallization: 45-90 days (depending on process complexity)
Ceramic Insulation Plates are indispensable foundational materials in modern high-power, high-voltage, and high-reliability electronic and electrical equipment. Within extremely limited space, they must simultaneously perform the multiple roles of an electrical insulator, structural support, heat transfer path, and environmental barrier. Compared to traditional organic insulation materials (e.g., epoxy laminates, bakelite) or ordinary fiberglass boards, insulation plates made from high-performance engineering ceramics fundamentally solve the challenges of insulation failure, thermal management, and lifespan bottlenecks faced by high-end equipment during long-term operation, in harsh environments, and under demanding conditions. This is achieved through their unparalleled dielectric properties, mechanical strength, thermal stability, and non-aging characteristics.
Key Features:
Exceptional and Enduring High Insulation Reliability – Ceramic insulation plates possess extremely high volume and surface resistivity, along with excellent arc resistance and high Comparative Tracking Index. Their insulating properties hardly change over time, with temperature (within allowable ranges), or with environmental humidity. This provides lifelong reliable isolation protection for high-voltage circuits and power devices, effectively preventing short circuits, creepage, and breakdown accidents, thereby safeguarding both equipment and personnel.
Superior Mechanical and Thermo-mechanical Stability – The material offers high rigidity and flexural strength, enabling it to firmly support heavy electronic components and withstand vibration and shock. Its very low coefficient of thermal expansion ensures minimal thermal stress when connecting with different materials (e.g., silicon chips, copper circuits) due to temperature changes. This significantly enhances the long-term reliability of solder joints and prevents failures caused by thermal fatigue.
Broad Environmental Adaptability and Long Service Life – Ceramic materials are inherently fire-resistant, chemically corrosion-resistant, radiation-resistant, and do not release any gases. They can operate stably in extreme industrial environments involving high/low temperatures, high humidity, salt spray, oil contamination, and corrosive gases, with no performance degradation over time. This makes them the ideal choice for power electronics and industrial equipment that demand ultra-long service life, minimal maintenance, or operation in harsh environments.
