Ceramic Nozzle
MaterialsAvailable in alumina (Al₂O₃), zirconia (ZrO₂), and silicon carbide (SiC).We help select the right material based on your working conditions.
Key Features
Excellent wear resistance for longer service life
Strong corrosion and chemical resistance
High temperature stability
More reliable than metal nozzles in harsh environments
Consistent and precise spraying performance
ApplicationsUsed in spray systems, sandblasting, industrial cleaning, and fluid control in chemical and automation equipment.
Lead Time
Samples: 7–10 days
Mass production: 15–25 days(Depending on design complexity and quantity)
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Send us your drawing or requirements — we’ll get back to you quickly with a solution and quotation.
Product Name: High-Performance Silicon Carbide (SiC) Ceramic Sleeve
Product Material: Sintered Silicon Carbide (SSiC), Reaction Bonded Silicon Carbide (RBSiC/SiSiC), or Nitride Bonded Silicon Carbide (NSiC).
Material Characteristics: Extreme hardness (approaching Diamond), High thermal conductivity, Excellent thermal shock resistance, Outstanding chemical resistance (pH 0-14), Superior oxidation resistance at temperatures up to 1600°C, High modulus of elasticity, Extremely low coefficient of thermal expansion.
Application Fields: Mechanical seal faces, Magnetic pump bearings and sleeves, Sand mill liners, Slurry pump bushings, Hydrocyclone liners, High-temperature radiant tube liners, Spray nozzles for desulfurization (FGD).
Application Industries: Biomedical (High-purity process equipment), Advanced Machinery (Heavy-duty abrasives), New Energy (Lithium battery powder milling), Fluid Control (Abrasive slurry handling), Electronic Engineering (Semiconductor wafer carriers), Aerospace (High-temperature propulsion components), Petrochemical (Corrosive crude processing), Broad Semiconductor (CMP slurry systems).
Processing Difficulties: Extreme hardness makes diamond-tool grinding slow and cost-intensive, Maintaining tight geometric tolerances (cylindricity and concentricity) on thin-wall sleeves, Controlling surface finish (Ra < 0.05μm) for rotating face seals, managing thermal stress during the sintering of extra-large diameter sleeves.
Processing Flow: Powder synthesis → Cold Isostatic Pressing (CIP) or Casting → Green machining → High-temperature vacuum/pressure sintering → Precision diamond grinding (ID/OD) → Mirror polishing and lapping → Ultrasonic flaw detection → CMM inspection → Secure packaging.
Delivery Period: Standard specifications: 20-35 days, Customized large-diameter or complex sleeves: 40-60 days.
Product Name:Engineering-Grade Precision Silicon Carbide Ceramic Rods
Product Material:Pressureless Sintered Silicon Carbide, SiC
Material Characteristics:Ultra-high hardness, excellent wear resistance, high mechanical strength, outstanding thermal stability, low thermal expansion coefficient, superior chemical corrosion resistance, good thermal conductivity, long service life
Application Fields:Precision mechanical components, high-wear structural parts, high-load components, high-temperature environments, corrosive working conditions, semiconductor equipment components
Application Industries:Advanced machinery manufacturing, semiconductor industry, electronics industry, chemical processing industry, energy and power systems, industrial automation
Processing Difficulties:Extremely high hardness and brittleness, difficult machining, strict dimensional tolerance control, high requirements for grinding precision, demanding surface finish control
Processing Flow:Raw material preparation, powder forming, pressureless sintering, precision grinding, dimensional inspection, surface finishing, final quality inspection
Delivery Period:Standard products 2–3 weeks, customized precision products 3–5 weeks depending on size tolerance and quantity
Product Name: Ceramic Trays
Product Material: Aluminum Nitride (AlN)/Alumina (Al₂O₃)/Silicon Carbide (SiC)
Material Characteristics: High thermal conductivity, excellent thermal shock resistance, high temperature stability, chemical corrosion resistance, high mechanical strength
Application Fields: Semiconductor wafer processing, LED epitaxial growth, photovoltaic cell manufacturing, chemical corrosion environments, high-temperature heat treatment
Application Industries: Semiconductor manufacturing, LED and display, solar energy, chemical processing, aerospace
Processing Challenges: Large-size flatness control, thin-wall structure strength, high-temperature deformation prevention, surface contamination control
Processing Flow: Powder preparation → Forming → High-temperature sintering → Precision machining → Surface treatment → Quality inspection → Packaging
Delivery Time: 30-40 days, 45-60 days for customized specifications
Product Name: High Thermal Conductivity Ceramic Substrates
Product Material: Aluminum Nitride (AlN)/Silicon Carbide (SiC)
Material Characteristics: High thermal conductivity, excellent thermal shock resistance, electrical insulation, matched CTE with semiconductors, high temperature stability
Application Fields: Power electronic packaging, LED chips, laser devices, microwave circuits, semiconductor modules
Application Industries: Power electronics, semiconductor manufacturing, automotive electronics, aerospace, telecommunications
Processing Challenges: Thin substrate flatness control, via hole precision, metallization adhesion strength, thermal stress management
Processing Flow: Powder preparation → Tape casting → Lamination → High-temperature sintering → Surface grinding → Metallization → Laser processing → Inspection → Packaging
Delivery Time: 25-35 days for standard specifications, 40-50 days for customized designs
Product Name: High-Quality Ceramic Base Plates
Product Material: Aluminum Nitride (AlN)/Alumina (Al₂O₃)/Silicon Carbide (SiC)
Material Characteristics: High thermal conductivity, excellent thermal shock resistance, electrical insulation, high temperature stability, mechanical strength
Application Fields: Power module substrates, semiconductor packaging, LED heat dissipation, laser equipment, electronic sensors
Application Industries: Power electronics, semiconductor, automotive electronics, aerospace, telecommunications
Processing Challenges: Large-size flatness control, via hole precision, metallization reliability, thermal stress management
Processing Flow: Powder preparation → Forming → High-temperature sintering → Precision grinding → Metallization → Laser processing → Inspection → Packaging
Delivery Time: 30-40 days, 45-60 days for customized designs
Product Name: High Thermal Conductivity Ceramic Plates
Product Material: Aluminum Nitride (AlN)/Silicon Carbide (SiC))
Material Characteristics: High thermal conductivity, excellent electrical insulation, thermal shock resistance, high temperature stability, low thermal expansion
Application Fields: Power electronics cooling, LED heat dissipation, semiconductor packaging, laser equipment, microwave devices
Application Industries: Power electronics, semiconductor, telecommunications, automotive electronics, aerospace
Processing Challenges: Large-size thin plate flatness control, metallization bonding strength, thermal stress management, surface quality maintenance
Processing Flow: Powder preparation → Forming → High-temperature sintering → Precision grinding → Metallization → Inspection → Packaging
Delivery Time: 25-35 days, 40-50 days for customized requirements
Product Name: Advanced Ceramic Processing Silicon Carbide Rotor
Product Material: High-Purity Silicon Carbide (SiC)
Material Characteristics:High temperature resistance, Excellent wear resistance, Superior chemical inertness, High mechanical strength, Low thermal expansion
Application Fields:Semiconductor manufacturing, High-speed rotating equipment, Precision mechanical systems
Application Industries:Semiconductor production, Aerospace components, Automotive turbo systems, Industrial pumps
Processing Difficulties:Complex rotor geometry machining, Dynamic balance precision control, High-speed rotation stability, Surface finish requirements, Thin-wall structure integrity
Processing Flow:Powder preparation → Forming → Sintering → CNC machining → Dynamic balance testing → Surface treatment → Quality inspection → Packaging
Delivery Period:30-40 days
Product Name: Precision Porous Silicon Carbide Ceramic Sucker
Product Material: High-Purity Porous Silicon Carbide Ceramic
Material Characteristics:High temperature resistance, Excellent chemical inertness, Adjustable porosity, Good thermal shock resistance, High mechanical strength
Application Fields:Semiconductor wafer handling, Vacuum adsorption systems, High-temperature processing, Precision manufacturing
Application Industries:Semiconductor manufacturing, LED production, Solar cell fabrication, Microelectronics assembly
Processing Difficulties:Precise porosity control, Pore size uniformity, Surface flatness maintenance, Vacuum seal integrity, Thin-wall structure stability
Processing Flow:Powder preparation → Additive mixing → Forming → Sintering → Precision machining → Surface treatment → Quality inspection → Cleaning → Packaging
Delivery Period:30-45 days
Product Name: Wafer Adsorption Silicon Carbide Ceramic Sucker
Product Material: High-Purity Silicon Carbide Ceramic (SiC)
Material Characteristics:High thermal stability, Excellent wear resistance, Superior chemical inertness, High mechanical strength, Low outgassing
Application Fields:Semiconductor wafer handling, Vacuum adsorption systems, Precision manufacturing equipment
Application Industries:Semiconductor fabrication, LED manufacturing, Solar cell production, Microelectronics assembly
Processing Difficulties:Precise micro-hole drilling, Surface flatness control, Vacuum seal integrity, Thin-wall structure machining, Thermal stress management
Processing Flow:Powder preparation → Forming → Sintering → CNC machining → Surface polishing → Quality inspection → Cleaning → Packaging
Delivery Period:30-40 days
Product Name: Silicon Carbide Ceramic Wafer Support Tray
Product Material: High-Purity Silicon Carbide Ceramic (SiC ≥99.9%)
Material Characteristics:High thermal conductivity, Excellent thermal shock resistance, Outstanding chemical inertness, High mechanical strength, Low thermal expansion, Superior wear resistance
Application Fields:Semiconductor wafer processing, High-temperature thermal processing, Chemical vapor deposition systems, Diffusion furnace applications
Application Industries:Semiconductor manufacturing, LED production, Solar cell manufacturing, Power device packaging
Processing Difficulties:Large-area thin-wall structure fabrication, Warpage control during high-temperature sintering, Precise flatness maintenance, Surface contamination prevention, Micro-crack avoidance in brittle material, Dimensional stability assurance
Processing Flow:Powder preparation → Slurry process → Tape casting → Lamination → Sintering → CNC machining → Surface polishing → Quality inspection → Ultrasonic cleaning → Packaging
Delivery Period:35-45 days
Product Name: High-purity Thin Silicon Carbide Ceramic Indexing Disk
Product Material: High-Purity Silicon Carbide (SiC)
The material can be made from high-purity silicon carbide powder (≥99.9%) .
Material Characteristics:High hardness and wear resistance, Excellent thermal stability, Low thermal expansion, Superior corrosion resistance, Good thermal conductivity, High mechanical strength .
Application Fields:Semiconductor manufacturing equipment, Precision measurement systems, High-temperature processing equipment .
Application Industries:Wafer processing and inspection, Electronic components production, Automotive electronics packaging .
Processing Difficulties:Precise thin disk flatness control, Micro-crack prevention in high-hardness material, Maintaining dimensional accuracy during sintering, Achieving high surface finish, Avoiding deformation in large-area thin disks, Ensuring uniform material properties .
Processing Flow:Powder preparation → Forming → Sintering → Precision grinding → Surface polishing → Quality inspection → Cleaning and packaging .
Delivery Period:30-45 days
Product Name: Packaging Mechanical Bonding Head Silicon Carbide Ceramic Parts
Product Material: High-Purity Silicon Carbide Ceramic (SiC)
Material Characteristics:High hardness and wear resistance, Excellent thermal conductivity, Low thermal expansion, Outstanding chemical stability, High mechanical strength
Application Fields:Semiconductor packaging equipment, Electronic component assembly, Precision bonding systems
Application Industries:IC packaging production, LED manufacturing, Microelectronic assembly, Automotive electronics packaging
Processing Difficulties:Complex geometry machining, High-precision dimension control, Thin-wall structure processing, Surface quality maintenance, Brittle material handling, Tight tolerance requirements
Processing Flow:Powder preparation → Forming → Sintering → CNC machining → Grinding → Polishing → Inspection → Cleaning
Delivery Period:30-40 days
Product Name: Semiconductor Porous Silicon Carbide Ceramic Sucker
Product Material: Porous Silicon Carbide Ceramic
Material Characteristics:Adjustable porosity, High temperature resistance, Excellent thermal shock resistance, Good mechanical strength, Outstanding corrosion resistance
Application Fields:Semiconductor wafer handling, Vacuum chuck systems, High-temperature processing, Precision manufacturing
Application Industries:Semiconductor manufacturing, Electronic components production, Precision instrumentation, Solar cell production
Processing Difficulties:Precise porosity control, Uniform pore distribution, Maintaining dimensional stability, Achieving surface flatness, Preventing micro-cracks
Processing Flow:Powder preparation → Additive mixing → Forming → Sintering → Precision machining → Surface treatment → Quality inspection → Cleaning and packaging
Delivery Period:30-45 days
Product Name: 0.5mm Small Hole Silicon Carbide Parts for Aerospace Equipment
Product Material: High-Purity Silicon Carbide
Material Characteristics:High hardness and wear resistanceExcellent thermal stabilitySuperior corrosion resistanceGood thermal conductivityLightweight and high strength
Application Fields:Aerospace thermal protection systems, High-temperature engine components, Satellite and spacecraft structures
Application Industries:Aviation and spacecraft manufacturing, Defense and satellite communication, High-performance mechanical systems
Processing Difficulties:Micro-hole drilling with high precision, Crack prevention in high-hardness material, Maintaining hole diameter consistency, Achieving smooth inner surface finish, Avoiding micro-fractures during processing, Ensuring dimensional accuracy under high-temperature conditions
Processing Flow:Powder preparation → Forming → Sintering → Precision machining → Surface treatment → Quality inspection → Cleaning and packaging
Delivery Period:30-50 days